William Cheng is currently a Lead Engineer at T. Rowe Price, a position they have held since 2020. Previously, they served as a Vice President at Goldman Sachs from 2007 to 2015 and as a Tech Lead at Custora from 2015 to 2020. William earned a BA in Computer Science and Economics from Cornell University, an MBA in Business Analytics from New York University - Leonard N. Stern School of Business, and a Master of Engineering in Computer Science from Cornell University. They completed their high school education at Markham District High School.
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