Chia Hsuan Chang

Chia Hsuan Chang is a skilled engineer currently serving as a Senior Process Engineer in Wet Etch at TSMC since March 2021, having previously held the position of Process Engineer in Wet Etch and completed a Process Engineering Internship at the same company. In the internship role, Chia Hsuan Chang initiated a Design of Experiments (DOE) to optimize the fin trim process for the development of 3 nm semiconductor manufacturing. Chia Hsuan Chang also contributed to research at Columbia University as a Masters Researcher in Polymer Simulation, focusing on DNA-mediated particles for drug transportation, and engaged in undergraduate research at National Central University, where efforts included identifying colon cancer stem cells for targeted therapy. Chia Hsuan Chang earned a Master of Science in Chemical Engineering from Columbia University and a Bachelor of Science in Chemical Engineering from National Central University, with additional academic experience through an exchange program in Bioengineering and Biomedical Engineering at the City University of Hong Kong.