Kathy Yan is the Director of Advanced Packaging Technology and System Integration at TSMC, where they manage advanced packaging technology services and lead customer co-development projects across multiple regions. With over 15 years of experience in R&D management in the semiconductor and medical device industries, they have a proven track record in technical program management and strategic planning. Previously, Kathy worked at Intel Corporation in various engineering roles and served as a Senior Engineering Manager at Medtronic. They hold a B.S. in Electrical Engineering and two advanced degrees in Materials Engineering and Electrical Engineering from Auburn University.
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