Yuan-Ching Lu has been with TSMC since April 1998, currently serving as a Department Manager in Advanced Packaging CIM within the Intelligent Manufacturing Center. Key achievements include the customization and deployment of the Digitized Fab systems for TSMC's 3DIC Fabs, streamlining and automating the tool release process for advanced technology nodes, and enabling cloud-based design platforms for customer innovations. Prior roles involved significant contributions to manufacturing technology integration and the introduction of machine-learning solutions to improve production yields in LED and semiconductor processes. Yuan-Ching Lu holds an MBA focused on Technology, Innovation, and Intellectual Property Management from National Cheng Chi University, as well as master's and bachelor's degrees in Mechanical Engineering from National Chiao Tung University. Previous experience includes a senior software engineering role at Applied Materials.
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