Hui Lin Wang

Hui Lin Wang is an R&D Integration Technical Manager at United Microelectronics Corporation (UMC) since October 2016, specializing in MRAM integration processes, yield demonstrations, MTJ performance studies, and advanced memory technology. Previously, Hui Lin Wang served as an Assistant Technical Manager in the Thin Film Module, evaluating MRAM MTJ PVD deposition systems and developing related stacks. Academic experience includes roles as a Graduate Teaching Assistant and Graduate Research Assistant at the University of Toronto, where Hui Lin Wang coordinated large classes, taught multiple courses, and conducted research on doped carbon films and nanowires. Education includes a Ph.D. in Electrical & Computer Engineering from the University of Toronto and a Master's and Bachelor's degree in Materials Science and Engineering from National Tsing Hua University. Additional experience encompasses research internships at UC Davis and TSMC and a position at the Industrial Technology Research Institute.