Unisem
WK Lam has over three decades of experience in package development and process engineering within the semiconductor industry. Since May 2007, WK Lam has served as a Senior Specialist Engineer at Unisem, focusing on new package development and establishing processes that accommodate both gold and copper wire requirements. Prior to this role, WK Lam worked at Carsem from January 1989 to May 2007 as Section Manager, where responsibilities included new package development in hermetic, discrete, integrated circuit (IC), and multi-layer packaging (MLP), as well as process development.
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Unisem
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Unisem is a global provider of semiconductor assembly and test services; offering an integrated suite of services such as wafer bumping, wafer probing, wafer grinding, IC packaging, and high-end RF and mixed-signal test services.