Bong Carrera II

Bong Carrera II has a diverse and extensive work experience in the engineering field. Bong started their career in 2001 with Amkor Technology as a Process/Development Engineer, working on various projects including Tape Array BGA/Chip Array BGA and FlipChip BGA. In 2005, they joined NXP Semiconductors - Calamba as a Senior Package/Process Development Engineer, leading projects such as LAMP3 and SbSIP. Bong continued to work for NXP Semiconductors - Calamba until 2008, holding the position of Senior Process Development Engineer and handling responsibilities such as process development for Flip Chip and BGA packages. From 2008 to 2018, they joined Texas Instruments, initially as a Process Development Engineer and later becoming the Department Manager. During their time at Texas Instruments, they were involved in process development and managed a department. In 2018, they moved to Amkor Technology, Inc. as the Head of Engineering Department, overseeing engineering operations until 2020. Currently, they are serving as the Head of the Engineering/Facilities Department at Varex Imaging Corporation.

Bong Carrera II studied at the University of the Philippines from 1995 to 2000, where they pursued a Bachelor of Science degree in Metallurgical Engineering.