Ehren Jarosek

Ehren Jarosek is an accomplished technology executive with extensive experience in engineering and video platform management. Currently serving as Senior Vice President of Technology at ViaPath Technologies since January 2022, Ehren previously held various leadership roles at Global Tel*Link from August 2014 to January 2022, including Vice President of Engineering and Executive Director of Video Platforms and System Architecture. Prior experience includes serving as Principal Engineer at Renovo Software Inc. from November 2003 to July 2014 and holding software engineering positions at Todd Video Network Management and Todd Communications from 2001 to 2003. Early in the career, Ehren gained experience as an intern at Lockheed Martin from 1997 to 2000. Ehren holds a degree from the University of Wisconsin-Madison, where studies were completed between 1996 and 2001.