Bo Ding

Bo Ding is a Staff Engineer and Data Scientist at Western Digital, where they spearhead process development for Chemical Mechanical Planarization (CMP) in next-generation hard disk drives. Bo previously held engineering and research roles at Applied Materials and a stealth startup, leading innovations in autonomous driving technologies and semiconductor processes. Their academic background includes a PhD in Materials Science from the University of Pittsburgh and current studies toward a Master’s in Computer Science at Georgia Tech. Additionally, Bo serves as President of the Chinese Association for Science and Technology-Silicon Valley Chapter, organizing events to promote high-tech initiatives.