Tymon Barwicz

Tymon Barwicz has extensive work experience in the field of photonic integration. Tymon is currently leading a team at X, the moonshot factory, where they are working on the productization of free-space optical communication. Their responsibilities include photonic integrated circuit design, fabrication, and testing, as well as photonic/electronic integration and module packaging.

Prior to their current role, Tymon worked at Cisco as a Principle Engineer, where they led a next-gen photonic integration project for low-cost optical amplification. Tymon proposed concepts, managed the project, selected and managed external partners, and negotiated contracts.

Before their time at Cisco, Tymon was a Principle Scientist at Acacia Communications Inc., where they focused on next-generation photonic integration. Tymon proposed and drove new concepts and executed novel designs, fabrication, and assembly.

Tymon also has research experience at IBM, where they led Si photonic packaging research. Tymon contributed to the concept, design, and fabrication of various photonic devices, including CMOS integrated photonics, photonic methane sensors, and photonic quantum transducers.

Additionally, Tymon has worked as a Postdoctoral Associate at MIT.

Tymon Barwicz completed a Bachelor of Engineering degree in Engineering Physics at Polytechnique Montréal from 1996 to 2000. Subsequently, they pursued further studies at the Massachusetts Institute of Technology, where they obtained a Ph.D. degree in Materials Science and Engineering from 2000 to 2005.