Hongyi Jin

Hongyi Jin has a strong background in engineering and technology, with current experience as a Software Engineer at 小米科技 since December 2018, specializing in credit risk modeling. Previously, Hongyi Jin worked as a Research Scientist at IBM from November 2016 to November 2017 and as a Hardware Engineer at Mindray during August 2014 to November 2014, focusing on power circuit testing. Hongyi Jin holds a Master's degree in Electrical Engineering from Columbia University, attained in 2016, and a Bachelor's Degree in Electronic and Computer Engineering from The Hong Kong University of Science and Technology, completed in 2014.