Trieu Ho Van is a skilled engineering professional with extensive experience in the field of electronics and telecommunications. Currently serving as a Field and Application Engineer at Yokowo Co., Ltd. since July 2021, Trieu previously worked as a Sales and Services Engineer at MN Computers LTD from November 2020 to June 2021. Trieu gained significant expertise at Intel Corporation from July 2011 to October 2020 as a Process and Equipment Engineer, where responsibilities included product startups and technical transfers from the U.S., as well as process improvements. Earlier experience includes a role as Equipment Specialist and Team Leader at Intel Product Vietnam, complemented by an internship. Trieu holds an Engineer’s Degree in Electronics Telecommunication Engineering from the Industrial University of Ho Chi Minh City, earned between 2008 and 2013.
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