Jaime Campos is a Senior Physical Design Engineer at AMD since June 2020, specializing in L2/L3 Cache Physical Design and managing tape-out processes through to ECO closure. Previously, Jaime served as a Graduate Research Assistant at the University of Maryland's A. James Clark School of Engineering, where development of an ASIC for sensor measurement was undertaken, improving chip generations and transitioning to 180nm technology. Jaime also gained experience as a Memory Mixed-Signal Design Verification Engineering Intern at Micron Technology, conducting HSPICE simulations and presenting technical information on memory blocks. Additional roles include serving as an Undergraduate Teaching Assistant at the Cockrell School of Engineering and as an Undergraduate Research Assistant at the Microelectronics Research Center at the University of Texas at Austin. Jaime holds a Master’s degree in Electrical and Computer Engineering from the University of Maryland and a Bachelor’s degree in Electrical and Computer Engineering from the University of Texas at Austin.
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