Yasya Srilekha Vallabhaneni

Yasya Srilekha Vallabhaneni is an experienced engineering professional specializing in electrical and electronics engineering. Currently serving as a Member of Technical Staff Packaging Engineer at AMD, Yasya has previously worked as an IC packaging engineer at Intel Corporation and as a Research Assistant at the University of California, Riverside. Yasya holds a Master's degree in Electrical and Electronics Engineering from the University of California, Riverside, completed in 2015, and a Bachelor of Technology in Electronics and Communication Engineering from Jawaharlal Nehru Technological University, earned in 2014.