Federico F.

Federico F. has a solid work experience in the electronics industry. Federico currently works as a Principal Packaging Engineer at Allegro MicroSystems since 2023. Prior to that, they held the role of Package Design - Package Platform Leader at STMicroelectronics from 2019 to 2023. Federico also has a long tenure at STMicroelectronics where they worked as a Senior Wire Bonding and Plasma Process Engineer from 2000 to 2018. During this time, they were involved in wire bonding and plasma process engineering, including training and maintenance of wire bonding machines. Federico also worked as a Designer from 2005 to 2008 and as an FE Manufacturing Process Engineer from 2000 to 2005.

Federico F. attended Politecnico di Milano and studied Mechanical Engineering. No further information on start year, end year, or degree obtained is available.