Michael Roxas

Michael Roxas is currently working as a Principal Product Engineer at Allegro MicroSystems since 2021. Prior to that, they worked at II-VI Incorporated as a Principal Product Engineer from 2017 to 2021, where they were responsible for NPI and mass production of multimode VCSEL Arrays for 3D sensor applications. Michael also worked at Qualcomm from 2017 to 2017 as a Product Test Engineer (RMA), focusing on improving RMA debug/response time and developing quality metrics. Before that, they spent a significant portion of their career at Qualcomm from 2004 to 2016 as a Sr. Staff Product Engineer, where they supported new product introduction, qualification processes, and yield improvement of SoC and mixed-signal xDSL Broadband Access Devices. Michael also worked at STATS ChipPAC as a Product Engineer from 2000 to 2004, handling new device transfers and failure analysis. Additionally, they have experience as a Sr. Test Product Engineer at Philips Semiconductors from 1995 to 2000, and as a Test Maintenance Engineer at Rohm Semiconductor from 1993 to 1995.

Michael Roxas earned their Bachelor's Degree in Electronics and Communications Engineering from Mapúa University from 1988 to 1993.