Weidong Wang

Weidong Wang is an experienced engineering professional with a robust background in advanced packaging technology, currently serving as Director of Packaging Development & Applications at Allegro MicroSystems since 2020. With a comprehensive career that spans various roles, including Senior Manager and Principal Engineer at Allegro, Senior Staff Packaging Engineer at Analog Devices, and Principal Engineer at SRI International, Weidong has demonstrated expertise in developing advanced IC packaging solutions, MEMS, and semiconductor power electronics. Educational credentials include a Ph.D., M.S., and B.S. in Electrical Engineering from Tsinghua University. Notable accomplishments include project management, client engagement, and multi-million-dollar proposal generation throughout a diverse and impactful engineering career.