Avi Cohen

Vice President Operations at Alphawave Semi

Avi Cohen has a diverse work experience in various companies. Avi is currently the Vice President of Operations at Alphawave Semi, a position they have held since October 2022. Previously, Avi served as the Vice President of Operations at Banias Labs, which was later acquired by Alphawave IP, from April 2021 to October 2022.

Before joining Alphawave, Avi worked at Apple as a VLSI Packaging, Quality, and Reliability Engineering expert from September 2018 to April 2021. In this role, they were responsible for maintaining quality standards and achieving quality targets for existing and new products.

Avi also had a significant tenure at DSP Group, where they held various roles, including Director of Product Engineering & Package Development and Director of IC Assembly & Package Development. Avi contributed to the development of assembly and packaging solutions for advanced ICs and managed relationships with suppliers and vendors. Avi's journey at DSP Group started as a Manager in IC Assembly & Package Development from June 2012 to January 2015.

Furthermore, Avi began their career at Marvell, where they worked as an IC Packaging Engineer and later as a CAD Tools Administrator from October 2006 to June 2012.

Avi Cohen obtained a Bachelor of Science (BSc) degree in Electrical Engineering from Braude Academic College between 2004 and 2007. In terms of certifications, Avi obtained various certifications from different institutions such as IEEE and SII-the standards institution of Israel. These certifications include "Thermal Management of Electronics" (2022), "FAN-OUT WAFER-LEVEL PACKAGING AND 3D PACKAGING" (2018), "FUNDAMENTALS OF RF DESIGN AND FABRICATION PROCESSES OF FAN-OUT WAFER/PANEL LEVEL PACKAGES AND INTERPOSERS" (2018), "FAN-OUT WAFER LEVEL PACKAGING" (2016), "INTRODUCTION TO MECHANICS BASED QUALITY AND RELIABILITY ASSESSMENT METHODOLOGY" (2016), "Quality Management System Lead Auditor (ISO 9001:2015)" (2016), "Package Failure Mechanisms, Reliability, And Solutions" (2014), "Wafer Level Packaging" (2014), "AutoCAD" (Institution: John Bryce), "Excel basic and advanced" (Institution: John Bryce), "Managers Development Course For Team Leaders" (Institution: Adam Milo), and "Practical Aspects Of Signal Integrity" (Institution: Nistec).

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Timeline

  • Vice President Operations

    October, 2022 - present