Yu-Chun Chen

Yu-Chun Chen is a seasoned professional with extensive experience in the semiconductor packaging and advanced technology sectors. Currently serving as the Director of the Chiplets/FCBGA Business Unit at Amkor Technology, Inc., since September 2015, Yu-Chun has a proven track record in customer account management, program management, research and development, quality assurance, and business strategy. Prior to this role, Yu-Chun worked at Intel Corporation from June 2011 to July 2015, where responsibilities spanned technology transfer integration and process development as a Senior Packaging R&D Engineer and Senior Process Engineer. An academic background includes a PhD and Master’s degree in Electrical and Computer Engineering from Auburn University, along with research roles at Georgia Institute of Technology and the Carnegie Institution for Science, focusing on advanced materials and fabrication techniques.