Le Duong

Substrate Package & Systems IC

Le Duong currently serves as a Substrate Package & Systems IC at Ampere since September 2025. Prior to this role, Le Duong was the Substrate Design Leader at Nidec SV Probe from May 2022 to September 2025. Le Duong began a career at Fujitsu in January 2020, holding the position of MLO LAYOUT until May 2022.

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