Ryan MacDonald

Ryan MacDonald is an accomplished engineering professional with extensive experience in semiconductor packaging and quality engineering. Currently serving as Engineering Manager for Semiconductor Packaging at Analog Devices, Ryan has held roles such as Staff Engineer and DFM SiP Process Engineer, showcasing expertise in design for manufacturability. Previous positions include Supplier Quality Engineer for Semiconductor Components & Modules at Apple and Semiconductor Packaging Engineer at Texas Instruments, where additional experience was gained as a Packaging Engineering Intern. Early in their career, Ryan contributed as an Engineering Intern for CardioThoracic Systems at Atrium Medical. Ryan holds a Bachelor of Science degree in Materials Science & Engineering with a concentration in Nanoscience & Molecular Engineering from the University of Washington, obtained between 2010 and 2014.