YI CHENG LI

Yi Cheng Li's work experience starts with their current position as an Advanced Engineer at Andes Technology Corporation, where they have been working since July 2021. Prior to that, they worked as a Firmware Engineer at Maxiotek Corporation from July 2020 to December 2021. Before that, they worked as a Firmware Engineer at Huawei Microelectronics from June 2018 to March 2020. Their earliest recorded work experience is as a Customer Service Engineer at Taiwan Material, where they worked from November 2016 to June 2017.

Yi Cheng Li earned a Bachelor's degree in Electrical Engineering from National Sun Yat-Sen University. The specific start and end years of this educational experience are not provided.