Michael Brunetti

Embedded Engineer at Andium

Michael Brunetti has worked in various roles in the software engineering industry since 2013. In 2013, they worked as an Engineering Co-op at Analogic where they acquired data using scanners and luggage containing simulated explosives. Michael then worked as a Failure Analysis/Fault Isolation Engineering Co-op at Intel Corporation in 2014 where they conducted experiments related to semiconductor fault isolation sample prep. In 2015, they worked as an Apprentice Engineer at Photo Diagnostic Systems, where they supported a team designing medical and airport security imaging systems. From 2016 to 2021, they worked at Camfil as a Research and Development Engineer, developing electronics for a research and development department. In 2021, they worked as a Software Engineer at Sterling Medical Devices, developing embedded firmware on dual-core ARM SoC for a novel medical device. Finally, they are currently working as an Embedded Software Engineer at Andium since 2022.

Michael Brunetti graduated from Northeastern University in 2016 with a Bachelor of Science degree in Electrical Engineering, Physics, and a Minor in Mathematics.

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Timeline

  • Embedded Engineer

    December, 2022 - present

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