Ryan Spies

Ryan Spies is a Mechanical Design Engineer at API Heat Transfer, where responsibilities include calculating, designing, and detailing various heat transfer systems, including TEMA Types and Graphite Heat Exchangers, since October 2017. Previously, Ryan worked as a Design Manufacturing Engineer at SOLBERN LLC, focusing on food processing equipment design using CAD software, and as a Research and Development/CAD design Intern at Parker Hannifin. Earlier experience includes serving as an Optical Technician at Optimax Systems, where high precision optical aspheric lenses were manufactured, and conducting research at Syracuse University, analyzing cricket chirping movements using MATLAB and high-speed cameras. Ryan holds a Bachelor of Engineering in Mechanical Engineering from the University at Buffalo and an Associate in Engineering and Science from Monroe Community College.