Yasen Yasenov is an experienced HW System Integration Engineer at Apple, with prior internship experience as a PCBA Development Intern at HGST, a Western Digital company, and as an Analog/Mixed Signal IC Intern at Pacific MicroCHIP Corp. Yasenov holds a Master's Degree in Electrical Engineering from UCLA, earned between 2012 and 2013, and a Bachelor's Degree in Electrical Engineering from UC San Diego, completed in 2012.