ASM International NV
Ramez Kiriakos is a skilled mechanical engineer currently serving as a Sr Mechanical Engineer I at ASM since August 2023. Previously, Ramez held the position of Graduate Research Assistant at Rutgers University–New Brunswick from September 2017 to May 2023, where expertise in experimental fluid dynamics was developed through work with various wind tunnel equipment. Ramez also contributed as a Mechanical Engineer at LafargeHolcim between November 2015 and July 2017, overseeing preventive maintenance and troubleshooting of heavy equipment. Experience as a Supply Planning Trainee at Unilever Mashreq Personal Care in mid-2015 involved applying lean manufacturing principles. Additionally, Ramez completed a traineeship at Schlumberger, gaining hands-on exposure to drilling operations. Ramez holds a Doctor of Philosophy in Mechanical and Aerospace Engineering from Rutgers University–New Brunswick, achieved in May 2023, and a Bachelor of Science in Mechanical Engineering from The American University in Cairo, completed in May 2015.
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ASM International NV
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ASM International N.V. is a supplier of wafer processing equipment, primarily for semiconductor manufacturing industry. The Company designs, manufactures and sells equipment and services to its customers for the production of semiconductor devices, or integrated circuits (ICs). The Company operates in two segments, which include Front-end and Back-end. The Front-end segment manufactures and sells equipment used in wafer processing, encompassing the fabrication steps in which silicon wafers are layered with semiconductor devices. The front-end segment includes manufacturing, service, and sales operations in Europe, the United States, Japan and South East Asia. The Back-end segment manufactures and sells equipment and materials used in assembly and packaging, encompassing the processes in which silicon wafers are separated into individual circuits. The Company supplies equipment to the manufacturers of analog semiconductor devices primarily for the deposition of thin films.