Teng Kim Yen is a seasoned Senior Mechanical Design Engineer at ASMPT Ltd since August 2016, specializing in the design and development of front-end and back-end semiconductor equipment for various packaging applications. Prior experience includes roles as a Mechanical Design Engineer at Trimech Technology Pte Ltd, focusing on thermode tooling, and at Visdynamics Holdings Bhd, where new product machines and quick change tooling turrets were conceptualized and designed. An engineering trainee position at Infineon Technologies involved resolving technical package and unit issues. Teng holds a Bachelor's degree in Mechanical Engineering (Honors) from Multimedia University and completed a course in Coding Basics at Rocket Academy.
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