Selahattin Berk Yilmaz

Selahattin Berk YILMAZ is a Senior Silicon Integration Engineer at Axelera AI, focusing on the holistic design of circuitry for AI processing units since December 2024. Previously, YILMAZ held positions as a Chip Package Design Engineer at Mobileye, where responsibilities included leading technical projects for LiDAR processors, and as a Principal Packaging/Assembly Engineer at indie Semiconductor, overseeing IC package designs for power and high-speed applications. With extensive experience in IC packaging hardware management from indie Semiconductor FFO (Silicon Radar) GmbH, YILMAZ has engaged in FEA analyses, design validation, and reliability qualifications. Earlier roles include hardware design at Endress+Hauser Group and EMT Controls, as well as an RF engineering internship at Turkcell. YILMAZ holds a master’s degree in Sensor Systems Technology from Karlsruhe University of Applied Sciences and a bachelor's degree in Electrical, Electronics and Communications Engineering from Izmir Institute of Technology.