Axus Technology delivers advanced process development expertise, equipment, and service support for:
     -- CMP & Polishing
     -- Wafer Thinning and Grinding 
     -- Edge Grinding and Profline
     -- Substrate Cleaning Applications
     -- Wafer Bonding Applications.

Axus'​ customers range from leading-edge production semiconductor manufacturers through small development facilities.  We deliver surface processing solutions to a broad range of technologies, including semiconductor, MEMs device processing, device packaging, TSV/3D Integration, materials processing and development, as well as for virtually any application where material needs to be made flatter, smoother, or thinner.   

Axus Technology supports a global customer base with a high-quality customer support experience known for delivering high quality, and often highly customized, processes and equipment.   

The Axus Technology team works with a broad array of substrates and films, applying fundamental and novel process technologies into new product applications.

Semiconductor

Axus Technology

Dan Trojan

Grazyna Bendisz

Teams at Axus Technology

Engineering Team

Operations Team