BE Semiconductor Industries N.V. (Besi) is a holding company. The Company is engaged in the development, manufacturing, marketing, sales and service of semiconductor assembly equipment for the global semiconductor and electronics industries. It operates through three segments: Die Attach, Packaging and Plating. It develops assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a range of end user markets, including electronics, computer, automotive, industrial and solar energy. The Company offers products, such as Die attach equipment, which include single chip, multi-chip, multi module, flip chip, thermo-compression bonding (TCB) and enhanced wafer level ball grid array (eWLB) die bonding systems, and die sorting systems; Packaging equipment, which include wafer level molding and singulation systems, and Plating equipment, which include metal plating systems and related process chemicals.

Electronics

Marketing

BE Semiconductor Industries NV

Richard Blickman

Leon Verweijen

René Hendriks

J.K. Park

Henk-Jan Jonge Poerink

Bart Berenbak

Jeroen Kleijburg

Peter Wiedner

Christoph Scheiring

Ruurd Boomsma

The Operations and Financial Management team at BE Semiconductor Industries NV is responsible for overseeing the efficient functioning of the company's operations while ensuring robust financial governance. This team harmonizes operational strategies with financial planning, audits, and controls, while also managing compliance and tax matters. Additionally, the team emphasizes sustainability through its ESG initiatives, aligning business practices with environmental and social considerations to enhance overall corporate responsibility.

Operations and Financial Management

Leadership Team

Operations and Financial Management

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Leadership Team