Piyush Gupta

Piyush Gupta is a Senior Director of Engineering at Qualcomm, where tenure began in August 2004, leading a team responsible for integrated circuit package design for mobile phone chipsets and managing multi-site teams across various geographies. Previous roles include working as a Director and Principal Engineer/Manager at Qualcomm. Prior to Qualcomm, Piyush served as a Research Assistant at the Georgia Institute of Technology from August 2002 to August 2004, focusing on packaging research, including evaluations of surface finishes for Pb-free solder and finite element modeling to assess stress and strain in flip-chips during temperature cycling. An internship at Intel occurred in 2003. Piyush holds an MS in Material Science from the Georgia Institute of Technology and a BTech in Materials and Metallurgical Engineering from the Indian Institute of Technology, Kanpur.