Bruce Estivil

Work Experience:

JPMorgan Chase & Co. (Sep 2024 - present): Software Engineer

JPMorgan Chase & Co. (Jun 2023 - Aug 2023): Software Engineer - Internship

HSBC (April 2021): Spring Week - Technology

Education:

MSc, Computer Science: (2020 – 2024)

Publications:

Networking and Internet Architecture (May 2024): 'SubwayMeshDTN: Exploring Opportunistic Delay Tolerant Routing Protocols when Disseminating Emergency Alerts on a Smart City Subway Network.

Awards:

Powerlist Magazine (Sep 2023): Top 150 Future Leader