Sanup Shrestha, MS, currently serves as an R&D Packaging Engineer at Boston Scientific since June 2025. Prior experience includes roles as Team Lead - Medical Device Packaging Engineer at TÜV SÜD from January 2023 to June 2025, and as Packaging Engineer I at Medtronic from June 2021 to January 2023, along with a Packaging Engineer Co-Op position at Medtronic earlier in 2020. Sanup's military service includes tenure as a Sergeant and M-1 Abrams Tank System Maintainer in the US Army from February 2015 to September 2019. Academic qualifications consist of a Master of Science in Engineering Management from the University of St. Thomas and a degree in Packaging Engineering from the University of Wisconsin-Stout.
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