Haziq Iqbal is a Design Engineer currently employed at DreamBig Semiconductor Inc. since November 2024, with previous experience at R&D Altanova from December 2022 to November 2024. During tenure at R&D Altanova, responsibilities included executing Multi-chip Module (MCM) package design projects for IC manufacturers, focusing on soldered packages for probe cards in wafer sort testing, and utilizing Cadence Allegro Package Designer for multi-layer organic (MLO) substrate layouts. Haziq Iqbal began professional career as an Engineering Intern at Indigo Textile (pvt) ltd in April 2021. Educational background includes a Bachelor of Engineering in Electrical Engineering from NED University of Engineering and Technology and earlier studies at Adamjee Govt. Science College and Usman Public School System.
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