Katsuyuki Sakuma

Katsuyuki Sakuma is a Principal Research Staff Member and Manager at IBM T.J. Watson Research Center, with a focus on System on Package (SOP) and 3D Integration since April 2000. Sakuma's expertise includes 3D integration technology for microprocessors and the development of three-dimensional (3D) LSI using through-silicon vias (TSVs) and solder interconnects. As a Visiting Professor at Tohoku University and Associate Editor for IEEE Transactions on Components, Packaging and Manufacturing Technology, Sakuma also holds senior membership in IEEE. Notable achievements include receiving the Japan Society of Applied Physics Appreciation Award in 2007 and being recognized as an IBM Technical Master in 2009. Sakuma has authored over 20 publications and has a background in mechanical engineering and nano science from Tohoku University and Waseda University.