Tim Hicks

Tim Hicks is a highly experienced professional who has worked in various engineering and managerial roles in the packaging industry. Currently serving as the Section Manager and Global Packaging Engineering Manager at Emerson, Tim manages design, testing, and development of product packaging for teams across the US, Asia, and Europe. With a background in engineering roles at companies such as National Instruments, Capital City Container, Motorola Mobility, Entegris, and Motorola Solutions, Tim has a Bachelor of Science degree in Packaging from Michigan State University.