Mats Slottner

Senior Principal Engineer, Packaging Technology Lead (r&d) at Fingerprint Cards

Mats Slottner has extensive work experience in the field of microelectronic packaging development. Mats started their career as a Development Engineer at Bellman&Symfon in 1993. Mats then worked as a Project Manager and later as the Head of R&D at Radians Innova AB from 1994 to 2000. In 2000, Mats joined Fingerprint Cards as the Manager of Advanced Packaging and held this position until 2013. Mats then became the Director of Microelectronic Packaging Development at Fingerprint Cards, leading the development and industrialization of new packaging technologies. In 2019, Mats took on the role of Senior Director of Optical and Packaging Systems Development at Fingerprint Cards, and in 2021, they transitioned to the position of Senior Director of Microelectronic Packaging Development. Throughout their career, Mats has been responsible for implementing novel packaging concepts and new assembly methods and has contributed to the introduction of numerous new products in the mobile industry.

Mats Slottner completed their education from 1988 to 1992 at Chalmers University of Technology. Mats obtained a degree in Electronics, specifically a M.Sc.EE.

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Timeline

  • Senior Principal Engineer, Packaging Technology Lead (r&d)

    December 1, 2023 - present

  • Senior Director Microelectronic Packaging Development R D

    October, 2021

  • Senior Director Optical And Packaging Systems Development OPAS R D

    February, 2019

  • Director Microelectronic Packaging Development

    December, 2013

  • Manager Advanced Packaging

    September, 2000

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