FlipChip International, LLC
William Fry is an experienced professional currently serving as an MTE at Intel Corporation since 2011, while also holding the position of Equipment Engineer at Flipchip International since October 2003. William Fry's academic background includes a Bachelor's degree in Project Management from DeVry University, completed from 2002 to 2004, and ongoing studies toward an MBA at Keller Graduate School of Management, which began in 2008. Prior education includes attendance at Petersburg High School.
FlipChip International, LLC
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FlipChip International is a world leading WLCSP bumping supplier, with wafer dicing and thinning capabilities, ASIC, ASPP and ASSP design, and a complete IC service from design to packaging.