Scott Chen

Scott Chen has a diverse work experience in the field of package engineering. Scott currently holds the position of Staff Package Engineer at Fortemedia, where they are involved in the design and documentation of 22nm WLCSP products and collaborates with ASIC RD to build product modeling through substrate/material Q3D simulation. Prior to this, they worked as a Package Section Manager at 美律实业 for four years. Scott has also served as a Senior Package Engineer at TDK InvenSense and a Package Engineer at 鑫创科技.

Scott Chen has a Master of Science degree from National Chiao Tung University. The specific field of study and the duration of their education are not provided.