Naga Chandrasekaran

Naga Chandrasekaran is Senior Vice President of the Technology Development at Micron Technology in Boise Idaho. Mr. Chandrasekaran leads process and equipment technology development and supplier roadmap development efforts for all memory and non-memory products. In addition he also manages corporate characterization labs and R&D fabrication operations at Micron’s headquarters in Boise, Idaho.

In 2001, he joined Micron as CMP development engineer and has since then held a series of positions of increasing responsibility in process development across multiple R&D process areas, leading manufacturing and technology transfer efforts, integration of new business units, and development of solar, LED, and display technology. Between 2007 – 2008, he also served as Fab Engineering Manager for IM Flash, Singapore Operations.

Mr. Chandrasekaran has several keynote publications, patents, and served as invited panel speaker in several conferences. He has also received several awards including the “Jiri Tlusty Outstanding Young Manufacturing Engineer of the year” awarded by Society of Manufacturing Engineers (SME) in 2003, and the “Engineering Manager of the year” awarded by the American Society of Engineering Management (ASEM) in 2018.

Mr. Chandrasekaran holds doctorate and master’s degrees in mechanical engineering, both from Oklahoma State University and dual Executive MBA from University of California, LA (UCLA-Anderson School of Management) and National University of Singapore (NUS).