Dan Stevens is a Product Development Engineer at Green Bay Packaging since September 2023. Previously, Dan held positions at Element Materials Technology as a Scientist II and Technical Manager from January 2022 to August 2023, and worked as a Research Scientist at Trimer Technologies, LLC from October 2021 to January 2022. Dan also served as a Senior Process Engineer at Tower Semiconductor between August 2020 and October 2021, and was a Graduate Research Assistant at Texas A&M University from August 2016 to August 2020, focusing on improving thermoelectric performance of multilayer polymer nanocomposite thin films. Early career experience includes work as an Undergraduate Research Assistant at Hope College, where Dan studied thermoelectric intermetallic nanoparticles, and served as a Group Session Tutor for organic and general chemistry. Dan holds a PhD in Materials Chemistry and Polymer Science from Texas A&M University and a Bachelor of Science degree in Chemistry from Hope College.