Ankush Mohan has a diverse range of work experience in the field of engineering, particularly in RF design and development. Ankush most recently worked at HRL Laboratories, LLC, where they served as the Group Lead for Advanced Packaging Solutions and a Senior Member of the Research Staff. At this company, Ankush led a group and conducted research in advanced packaging solutions.
Before that, Ankush worked at Mercury Systems as an R&D Engineer, where they were responsible for designing and overseeing the development of integrated microwave assemblies (IMA's). Ankush also managed product development, including design, assembly, testing, and program management.
Prior to Mercury Systems, Ankush held roles at Qorvo, Inc., serving as a Principal Research Development Engineer and an RF Design Engineering Manager. In these positions, they led research programs and managed a team of engineers. Ankush contributed to the development of high-power GaN-based SSPA prototypes and the expansion of Qorvo's SSPA IP portfolio.
Ankush also worked at Nuvotronics as an RF Engineer, where they were responsible for RF design, fabrication, assembly, and testing for various DARPA projects. Ankush utilized the Polystrata fabrication process and collaborated with a design team to develop next-generation concepts.
Early in their career, Ankush worked at Teledyne MEC as an R&D Engineer, managing defense and commercial programs and maintaining RF designs for TWT amplifiers. Ankush also held roles at L3 Communications as an RF Associate Engineer, overseeing TWT production, and as an RF Test Technician, supporting various testing processes.
Throughout their career, Ankush has demonstrated expertise in RF design, product development, research, and team management.
Ankush Mohan holds a Bachelor of Science degree in Electrical Engineering from San Jose State University. Ankush also pursued a Master of Science degree in Electrical Engineering at Santa Clara University. However, specific start and end years for their education are not provided.
November 1, 2022 - present
August, 2019