Paul Telesca

Paul Telesca is a Firmware Engineer at INFICON since May 2022, with prior experience as an IoT Embedded Software Engineer at Carrier HVAC, where responsibilities included the design and development of IoT telematics devices. Previous roles include a Jr. Scrum Master Intern at Travelport, where Paul assisted in company-wide SAFe transformation processes, and Software Engineer II at Lockheed Martin, focusing on radar system enhancements. Additional experience as a Software Engineer at IBM involved communications development for the z/TPF OS. An early role as a Software Engineer intern at C Speed included validation testing of medical devices. Paul holds a Master of Business Administration with a focus in Data Science/Analytics from the University of Colorado Boulder and a Bachelor of Science in Software Engineering from Clarkson University.