Dr. Niels Oeschler

Dr. Niels Oeschler had experience working as Team Lead Solder Technology at SIAPM, a joint venture of Infineon, from August 2017 to September 2020. Prior to that, Dr. Niels worked as Entwicklungsingenieur at Infineon Technologies from October 2010 to July 2017. Currently, Dr. Niels holds the position of Team Lead Sinter and Solder Technology at Infineon Technologies since October 2020.