Infineon
Safak Kececi is an experienced engineering professional with a comprehensive background in process integration and product engineering, currently serving as the Head of Process Integration and Product Engineering at Backend Operations for Infineon Technologies since May 2001. In this role, Safak is responsible for overseeing the Process Integration & Product Engineering of Wafer Level and Sensor Products for various applications, including automotive and industrial sectors. Prior experience spans multiple leadership roles in process integration, technology transfer, and inspections, both at Infineon and Siemens AG, where contributions included improving defect density and coordinating cleanroom management. Safak holds a Dipl.Ing.(FH) in Mechanical Engineering from Fachhochschule Regensburg.
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