Dinesh Thanu

Dinesh Thanu has extensive experience in the semiconductor industry, currently serving as an Engineering Area Manager in Advanced Semiconductor Packaging at Intel Corporation since December 2011. Dinesh has held various engineering and management roles within Intel, focusing on underfill modules, BGA modules, data analytics, and supply chain leadership. Prior to joining Intel, Dinesh worked as a Research Assistant at The University of Arizona and as a Process Engineering Intern at Micron Technology. Dinesh's academic background includes a PhD in Materials Science and Engineering with a minor in Electrical Engineering from the University of Arizona, an M.S. in Materials Science and Engineering from the University of Idaho, and a Bachelor's degree in Chemical and Electrochemical Engineering from the Central Electrochemical Research Institute. Teaching experience includes courses in Corrosion Science and Engineering and Analytical and Inorganic Chemistry.