Yanran Xie

Yanran Xie is an experienced Advanced Packaging Engineer with a strong background in photonics research and engineering. Previous roles include Photonics Researcher and Research Assistant at McMaster University, as well as Packaging and Integration Engineer at CMC Microsystems. Yanran Xie also contributed to the field as a Silicon Photonics Packaging Engineer at Nokia. With a PhD in Photonics, expertise spans across various aspects of packaging and integration in advanced materials and technologies.