Feng Bi

Feng Bi is a highly experienced Staff Process Engineer at Lam Research since January 2017, previously serving as a Senior Process Engineer and a Process Engineer at Applied Materials from April 2015 to January 2017, with a focus on 300 mm wafer processing and amorphous carbon film deposition. Prior experience includes a role as a Graduate Research Assistant at the University of Pittsburgh from August 2008 to April 2015, where Feng Bi contributed to the development of groundbreaking electronic materials and devices, publishing research in reputable journals such as Nature Nanotechnology and Nature Communications. Feng Bi holds a Ph.D. and an M.S. in Physics from the University of Pittsburgh and a BS in Physics from Nanjing University.