Vincent Georgel

Vincent Georgel is an experienced engineering professional specializing in packaging technologies, particularly in the field of System in Package (SiP) design. Currently serving as the Manager of Packaging Bolometers at LYNRED since May 2022, Vincent has a robust background that includes roles as a Package & Product Engineer at PYXALIS and a Package Development Engineer at Teledyne e2v, focusing on image sensor packaging for various applications. With prior experience as a Co-design Chip/Package Engineer at Intel Mobile Communications and as a SiP Engineer at both MAYA TECHNOLOGIES and ST-Ericsson, Vincent has extensive expertise in co-design and substrate modeling. Vincent began a career in microelectronics with a degree from Polytech Montpellier and advanced studies culminating in a PhD in Signal Processing from Université Paris-Est Marne-la-Vallée.