Hao Zhou

Dr. Hao Zhou is a serial entrepreneur who founded Qtech as general manager, where he developed COF (Chip On Flex) technology, which became mainstream CIS module assembly technology in the industry, and he also led the effort in pushing TSV (Through Silicon Via) technology based wafer level packaging into mass production. He was instrumental in selling the TSV business to a public company and TSV is one of the standard packaging technologies for CMOS imaging sensors in the industry. He has also started a multimode humanoid robot company as CEO and enjoyed exploring the frontier of artificial intelligence. He started his career as a lithography engineer and later as a program manager developing one of the world's first cell phone camera modules.

He holds a PhD in EE from LSU and a BS in Microelectronics from Peking University.